Solder-Crack prevention PWB
Concept
Connection reliability of the component and the substrate improves
Standard PWB
Small dimensional change
Large dimensional change
Large Image
Crack occurs
Solder-Crack suppressing PWB
Small dimensional change
Reduce dimensional change
Large Image
Low modulus Material is to defuse damage
- Use
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Products with sensors
- Stack-up
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Multilayer
HDI
- Number of layers
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4 layers～