Solder-Crack prevention PWB
Concept
Connection reliability of the component and the substrate improves
![](https://epc.elnapcb.com/wp-content/uploads/2018/10/b6d16323f28bd86e52eb04f5291ee8ee.png)
Standard PWB
Small dimensional change
Large dimensional change
Large Image
![Standard PWB](https://epc.elnapcb.com/wp-content/uploads/2018/10/38b760a87189d1d5c9bebfa39bb81534.jpg)
Crack occurs
Solder-Crack suppressing PWB
Small dimensional change
Reduce dimensional change
Large Image
![](https://epc.elnapcb.com/wp-content/uploads/2018/10/ad7e3d64da40d848341bf38d711d633b.jpg)
Low modulus Material is to defuse damage
- Use
-
Products with sensors
- Stack-up
-
Multilayer
HDI
- Number of layers
-
4 layers~