Multi layer printed circuit board
Overview
By electrically connecting each layer with a through-hole, it becomes a printed wiring board with high reliability.
![](https://epc.elnapcb.com/wp-content/uploads/2018/10/BVH-1.png)
Through-hole structure
16 layers Through-hole connection
![16 layers Through-hole connection](https://epc.elnapcb.com/wp-content/uploads/2018/10/b1d3de80a150c9e9a8dc3c0db97cabab.png)
![16 layers Through-hole connection](https://epc.elnapcb.com/wp-content/uploads/2018/10/f02e3e5f9c2657dc4dcdfa298c41dd85.jpg)
SVH structure
8 layer board SVH
![8 layer board SVH](https://epc.elnapcb.com/wp-content/uploads/2018/10/44c5217a3221f5a721764a4c6e281e08.png)
![8 layer board SVH](https://epc.elnapcb.com/wp-content/uploads/2018/10/44c5217a3221f5a721764a4c6e281e08.jpg)
IVH structure
8 layer board SVH
![8 layer board SVH](https://epc.elnapcb.com/wp-content/uploads/2018/10/e13ac08cc01d03c9a0cde60232d80202.png)
![8 layer board SVH](https://epc.elnapcb.com/wp-content/uploads/2018/10/IVH.jpg)
Thick copper specification
![](https://epc.elnapcb.com/wp-content/uploads/2018/10/09d410ebcf6777f2b0e3cbb46d0dc4a6.png)
![Thick copper specification](https://epc.elnapcb.com/wp-content/uploads/2018/10/1bcfbe2fcd1deef92dbac1e61956e28c.jpg)
- Features
-
Through-hole structure
High-reliability is ensured because the high-multilayer structure is connected by a through-hole.
SVH structure
Component mounting becomes possible right above the through hole, making it possible to reduce the board size.
IVH structure
Since it connects only inside the board with a through hole, miniaturization of board size and high density wiring become possible
- Use
-
AV equipment · home appliances
amusement
Industrial equipment · Lighting
Car audio / navigation
Onboard (ECU, body, electric power steering etc.)
Standard specification
Items | Standard specification | ||
---|---|---|---|
External layer | Min. Conductor width | 0.1mm(0.075) | |
Min. Spacing of conductor | 0.1mm(0.075) | ||
Internal layer | Min. Conductor width | 0.1mm | |
Min. Spacing of conductor | 0.1mm | ||
Conductor thickness of external layer | 18µm(35) | ||
Conductor thickness of internal layer | 35µm(18) | ||
Plating thickness of through hole (Combination Type) | IVH | 15µm | |
TH | 15µm | ||
Via | Smallest land diameter of external layer | Bump | φ0.4mm |
TH | φ0.5mm | ||
Smallest land diameter of internal layer | Bump | φ0.4mm | |
TH | φ0.5mm | ||
Smallest hole diameter | IVH | φ0.2mm | |
TH | φ0.25mm | ||
Number of layer | 4,6,8 |